产品
FIB-SEM
Nanomanipulators
OmniProbeOmniProbe Cryo软件
AZtec3DAZtecFeatureAZtec LayerProbeTEM
Hardware
EDSUltim MaxXploreImaging
软件
AZtecTEM
Metallisation layer connects different components together in semiconductor device and directly affects its performance. Occurrence of defects in metal layers will directly influence device performance. Therefore, failure analysis is crucial to find the cause of the defect and trace it back to the manufacturing process. A large-area Ultim Max 170 EDS detector is ideal for this type of analysis allowing significant throughput rates even when reducing SEM energy.
By downloading this application note, you will learn about: